![]() E-beam Evaporator 1 Coral ID:ĮVAP1 is an electron beam evaporator for depositing metal films. Materials RestrictionsĪll materials must be explicitly approved by staff. #Radio lab tool rtas only full#Sophisticated data preparation software provides advanced functions including full shape and dose proximity correction. A wide range of beam currents, choice of two objective lenses, and a wide range of resist processes provide significant flexibility for a variety of needs. Substrates from small chips to 150mm wafers. Detailsĭirect-write 100 kV Electron Beam Lithography capable of feature sizes as small as 10 nm, and layer-to-layer registration better than ~30 nm m+3s. Wafer dicing capable of 150mm diameter wafers and smaller. Wet bench with dedicated baths for photoresist developers Details Detailsħ2" PVC-C Front Access Wet Bench (Developer Station) Write modes HiRes with 300nm minimum feature, 4mm head with 0.8um minimum feature, and 20mm head with 2um minimum feature. DetailsĬreate masks or direct write on substrates with alignment capability utilizing a 405nm laser. The Tousimis Critical Point Dryer (CPD) uses liquid carbon dioxide (LCO2) to dry and release fragile parts without damaging the structure due to surface tension. It can be configured for many measurements and has a camera capable of recording video of moving MEMS devices. ![]() #Radio lab tool rtas only manual#This manual probe station is typically used to measure conductivity, IV curves, and capacitance. The stylus has a radius of 2 um and a cone angle of 60 degrees. It is capable of automated measurements with step detection. It can accommodate 100mm, 125 mm, and 150 mm wafers as well as smaller chips. It can also measure surface roughness and film stress. This is a contact profilometer capable of measuring step heights that range from tens of nanometers to one millimeter. (none) Bruker DektakXT Contact Profilometer Coral ID: DetailsĪccomodates substrate from chips up to 100mm diameter wafers. Argon Coral ID:Īrgon dual-cylinder switching manifold DetailsĪrgon is 99.999% pure (Linde AR 5.0UH-T) Materials Restrictionsīarrel asher used to strip resist or other organic films, descum patterned resist, or clean surfaces of residual organics using an isotropic oxygen plasma. Configured for exposure of 100mm wafers smaller chips can be accomodated using a carrier wafer. ![]() Uses 5in or 7in square photomasks with 0.090in thickness. An optimized process can achieve 2 um line/space patterns with a layer-to-layer registration accuracy about 3 um. Feeds panel PCB-01-N-06.īreaker located in HV room 116B Materials RestrictionsĬontact photolithography exposure tool for 100mm wafers. UW NNCI Site - WNF Lab Tool List 400V transformer Coral ID: ![]()
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